EVO Sonic

Ultrasonic cleaning, thorough and gentle

The cleaning of printed circuit boards, wafers, soldering frames and machine parts by immersion is an extremely powerful and gentle cleaning method. The agitation required for thorough cleaning is achieved by using ultrasound and/or Jet turbulation.

Particularly in the case of complex assemblies with difficult geometries or low standoffs as well as large quantities, EVO SONIC ultrasonic systems are able to exploit their advantages through the optimum division of process steps such as washing, rinsing and drying.

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